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 CYStech Electronics Corp.
High Frequency NPN Epitaxial Planar Transistor
Spec. No. : C213WC3 Issued Date : 2003.08.15 Revised Date : Page No. : 1/3
BTC5181WC3
Description
The BTC5181WC3 is a NPN Epitaxial Silicon Transistor designed for low noise microwave amplification application.
Symbol
Outline
SOT-523
BTC5181WC3
BBase CCollector EEmitter
Features
* Low current consumption and high gain: S21e = 12dB ( typ. ) at VCE= 2 V, IC= 7 mA, f = 2 GHz S21e = 11dB ( typ. ) at VCE= 1 V, IC= 5 mA, f = 2 GHz * Super mini-mold package
Applications
* Low noise and high gain amplifiers & Oscillator buffer amplifiers
Absolute Maximum Ratings (TA=25)
Parameters Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Base Breakdown Voltage Collector Current Collector Power Dissipation Junction Temperature Storage Temperature Symbol VCEO VCBO VEBO IC Pd Tj Tstg Limits 3 5 2 10 30 150 -65~+150 Unit V V V mA mW C C
BTC5181WC3
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristics (TA=25C)
Parameters Collector Cutoff Current Emitter Cutoff Current DC Current Gain Cutoff Frequency Noise Figure Insertion Gain |S21e|2 in 50 system Output Capacitance Conditions VCB =3V, IE=0 VEB =1V VCE =2V, IC =7mA (Note 1) VCE =2V, IC =7mA, f =2GHz VCE =1V, IC =5mA, f =2GHz VCE =2V, IC =3mA, f =2GHz VCE =1V, IC =3mA, f =2GHz VCE =2V, IC =7mA, f =2GHz VCE =1V, IC =5mA, f =2GHz VCB =2V, IE=0, f = 1MHz Symbol ICBO IEBO hFE fT NF |S21e| 2 Cob Min 70 10 8.5 -
Spec. No. : C213WC3 Issued Date : 2003.08.15 Revised Date : Page No. : 2/3
Typ. 12 10 1.5 1.5 12 11 0.7
Max 100 100 140 15.5 13 2.0 2.0 1.0
Unit nA nA GHz GHz dB dB dB dB pF
Note 1: Pulse test: Pulse width 380s, duty cycle 2%.
BTC5181WC3
CYStek Product Specification
CYStech Electronics Corp.
SOT-523 Dimension
Spec. No. : C213WC3 Issued Date : 2003.08.15 Revised Date : Page No. : 3/3
A
3
C
Marking:
D
1 2
B
T1 3E_
_ : hFE Rank Code
F H J
G I E
3-Lead SOT-523 Plastic Surface Mounted Package CYStek Package Code: C3
K M
L N O
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
DIM A B C D E F G H
Inches Min. Max. 0.0079 0.0157 0.0591 0.0669 0.0118 0.0197 0.0295 0.0335 0.0118 0.0197 0.0039 0.0118 0.0039 0.0118 *0.0197 -
Millimeters Min. Max. 0.20 0.40 1.50 1.70 0.30 0.50 0.75 0.85 0.30 0.50 0.10 0.30 0.10 0.30 *0.50 -
DIM I J K L M N O
Inches Min. Max. *0.0197 0.0610 0.0650 0.0276 0.0315 0.0224 0.0248 0.0020 0.0059 0.0039 0.0118 0 0.0031
Millimeters Min. Max. *0.50 1.55 1.65 0.70 0.80 0.57 0.63 0.05 0.15 0.10 0.30 0 0.08
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC5181WC3
CYStek Product Specification


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